Components design & fabrication

  • Chip-On-Board Assembly
  • Hybrid on ceramic
  • Lead-Frame, lead cutting & bending

Custom package designs

  • Ceramic substrate, PCB, Flex circuits, Optical filters, Custom windows, Scintillation crystals, Hermetic packages, surface mount devices

Standard packages

  • TO-18, TO-46, TO-5, TO-8, SMT-0805, SMT-1206